Accession Number : ADA321560

Title :   Advanced Composite Solders for Microelectronics. Phase 2.

Descriptive Note : Final rept.,

Corporate Author : HIGH PERFORMANCE MATERIALS INC HERMANN MO

PDF Url : ADA321560

Report Date : FEB 1997

Pagination or Media Count : 109

Abstract : The objectives of the Phase 2 work were (1) Increase solder powder production capacity of the RPM production facility from 10 lb/batch to 500 lbs/batch for the production of conventional 63 Sn-37 Pb solder powders, ternary and quaternary 63Sn-37 Pb-X( X=Ni,Cu,Ag,Sb,In or Bi) solder powders, and lead free Sn-based solder powders; and (2) Perform a comprehensive study of the physical, mechanical and solderability/wettability properties of the solder powders.

Descriptors :   *MICROELECTRONICS, *SOLDERING ALLOYS, SHEAR PROPERTIES, MICROSTRUCTURE, FATIGUE LIFE, TENSILE PROPERTIES, EXTRUSION, FRACTURE(MECHANICS), PRODUCTION CONTROL, CREEP, THERMAL FATIGUE, POWDER METALLURGY, THERMAL CYCLING TESTS, FATIGUE TESTS(MECHANICS), CYCLIC LOADS, EUTECTICS, LEAD ALLOYS, TIN ALLOYS.

Subject Categories : Metallurgy and Metallography
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE