Accession Number : ADA321689
Title : Modeling and Simulation of MMICS and Interconnects in Microwave Packages.
Descriptive Note : Final rept. May-Nov 96,
Corporate Author : HITTITE MICROWAVE CORP WOBURN MA
Personal Author(s) : Trantanella, Charles J.
PDF Url : ADA321689
Report Date : 18 NOV 1996
Pagination or Media Count : 59
Abstract : Two structures frequently encountered in modern day microwave subsystems are multichip modules (MCMs) and highly integrated monolithic microwave integrated circuits (MMICs). As these circuits become denser and more compact, electromagnetic simulation must be used to accurately predict the interaction between elements. In this report, we evaluate a number of commercially available electromagnetic simulation tools appropriate for the needs of an MCM or an MMIC designer. We start by offering a qualitative comparison of twelve simulators against our performance criteria, developed to address key issues important to electromagnetic simulation. Next, we report on two benchmarking studies which compared the performance of a number of different simulation tools. Finally, we present our conclusions regarding the choice of a particular simulation tool to best fit the needs of the designer.
Descriptors : *INTEGRATED CIRCUITS, SIMULATORS, SIMULATION, COMPARISON, CHIPS(ELECTRONICS), MICROWAVE EQUIPMENT, MODULES(ELECTRONICS), ELECTROMAGNETISM.
Subject Categories : Electrical and Electronic Equipment
Electricity and Magnetism
Distribution Statement : APPROVED FOR PUBLIC RELEASE