Accession Number : ADA323087
Title : High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems.
Descriptive Note : Progress rept. 1 Jul-30 Dec 96,
Corporate Author : ROCKWELL INTERNATIONAL ANAHEIM CA SCIENCE CENTER
Personal Author(s) : Chang, Charles ; Jani, Dharmesh ; Yen, Alfred ; Yang, K. C.
PDF Url : ADA323087
Report Date : 30 DEC 1996
Pagination or Media Count : 61
Abstract : During this period, significant progress has been made towards the demonstration of the advanced laser altimeter data acquisition unit. Our package design efforts have resulted in a fully functional GaAs chip set for the altimeter system that exceeds the requirement of the 800 Ms/s system and should be able to be used in the 3000 Ms/s system with little or no modifications. The 800 Ms/s data acquisition system design was finalized and committed to hardware. Extensive development efforts were applied to the software development needed to verify the performance of the complicated data acquisition system on the test bench. These effort have resulted in the successful demonstration of the 800 Ms/s data acquisition unit. The unit is tentatively scheduled for hand-delivery and demonstration at NASA Goddard in January, 1997. Although progress was made by Rockwell with the TELOS packaging effort and by UCSB for the design of the GaAs FIFO, this report is dedicated to the 800 Ms/s demonstration vehicle and serves as both the progress report and documentation for the unit.
Descriptors : *CHIPS(ELECTRONICS), *DATA ACQUISITION, SIGNAL PROCESSING, SOFTWARE ENGINEERING, DATA MANAGEMENT, GALLIUM ARSENIDES, INPUT OUTPUT PROCESSING, LASER APPLICATIONS, ALTIMETERS, ANALOG TO DIGITAL CONVERTERS, DATA PROCESSING TERMINALS, PACKAGED CIRCUITS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE