Accession Number : ADA324591

Title :   High Thermal Conductivity Graphite Electronic Components.

Descriptive Note : Quarterly progress rept. no. 1, May-Jul 96,

Corporate Author : LORAL SPACE SYSTEMS PALO ALTO CA

Personal Author(s) : Peck, S. O. ; Young, G. L. ; Mellberg, W. J. ; Wellman, A. F. ; Cooney, J. E.

PDF Url : ADA324591

Report Date : AUG 1996

Pagination or Media Count : 23

Abstract : This project will apply high thermal conductivity graphite to three major spacecraft electronic components: (1) the thermal plane of a printed wiring board, (2) the subassembly or tray that holds the board, and (3) the equipment panel that the tray mounts on. The complete heat transfer path from chip level heat source to radiative rejection on the exterior surface of the equipment panel will therefore be addressed. Thermal and structural requirements representative of current spacecraft will drive an optimized solution strategy. The project will be completed by fabricating the three prototypical test articles and measuring their performance in a representative space environment.

Descriptors :   *THERMAL CONDUCTIVITY, *GRAPHITED MATERIALS, *PRINTED CIRCUIT BOARDS, HEAT TRANSFER, TENSILE STRENGTH, SPACECRAFT, SPACE ENVIRONMENTS, CHIPS(ELECTRONICS), THERMAL STABILITY, THERMAL ANALYSIS, STRUCTURAL RESPONSE, THERMAL EXPANSION, SPACECRAFT COMPONENTS, ELECTRICAL RESISTANCE, COMPRESSIVE STRENGTH, SERIAL PROCESSORS, STRUCTURAL INTEGRITY.

Subject Categories : Electrical and Electronic Equipment
      Laminates and Composite Materials

Distribution Statement : APPROVED FOR PUBLIC RELEASE