Accession Number : ADA324633
Title : Semiconductor Packaging: A DoD Dual Use Technology Assessment.
Descriptive Note : Final rept.,
Corporate Author : DEPARTMENT OF DEFENSE WASHINGTON DC
PDF Url : ADA324633
Report Date : 1995
Pagination or Media Count : 76
Abstract : This assessment concludes that commercial capabilities for single-chip semiconductor packaging are sufficient to assure affordable access to meet military needs, and no action is required by the Department of Defense (DoD). Driven by markets in telecommunications, computers, consumer electronics, and automotive systems, the integrated circuit (IC) packaging industry is able to provide the mainstream packaging technology required by the DoD. Although predominantly offshore, IC assemblers and equipment suppliers are highly competitive and diversified. Packaging materials suppliers are concentrated in Japan, but there has been no indication that access to materials will be limited or denied.
Descriptors : *INTEGRATED CIRCUITS, *SEMICONDUCTORS, *PACKAGING, ELECTRONICS, DEPARTMENT OF DEFENSE, MILITARY REQUIREMENTS, MARKETING, COMPUTERS, MATERIALS, CHIPS(ELECTRONICS), JAPAN, CERAMIC MATERIALS, ACCESS, TELECOMMUNICATIONS, PLASTICS, CONSUMERS, AUTOMOTIVE COMPONENTS.
Subject Categories : Electrical and Electronic Equipment
Containers and Packaging
Logistics, Military Facilities and Supplies
Distribution Statement : APPROVED FOR PUBLIC RELEASE