Accession Number : ADA324731
Title : High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems.
Descriptive Note : Progress rept. 1 Apr-30 Jun 96,
Corporate Author : ROCKWELL INTERNATIONAL THOUSAND OAKS CA SCIENCE CENTER
Personal Author(s) : Chang, Charles ; Jani, Dharmesh ; Wang, K. C. ; Sullivan, Gerry ; Gertner, Edward
PDF Url : ADA324731
Report Date : 03 SEP 1996
Pagination or Media Count : 42
Abstract : In this report, progress on the high speed circuits and packaging technology for advanced laser altimeter systems is reported for the months of 1 April 1996 to 30 June 1996. During this time, significant progress has been made on both the 800 Ms/s and 3000 Ms/s data acquisition system. For the 800 Ms/s system, the ADC has been packaged and tested, the DEMUX substrate has been submitted for fabrication, and the packaged TIU is in the final stages of testing. The second cut schematic for the system has been designed and several PCB are presently being designed. The system timing of the 800 Ms/s system has been studied in great detail to assure the desired altimeter accuracy. For the high-speed system, the first test GaAs FIFO memory cells (512 x 1) have been fabricated and tested to 500 MHz. The memory design has been improved to make it less susceptible to switching noise. The second GaAs test cell has also be fabricated and is presently being tested. The CMOS FIFO is in the final design phase and should be submitted for fabrication in 3 months.
Descriptors : *INTEGRATED CIRCUITS, *ALTIMETERS, *ANALOG TO DIGITAL CONVERTERS, MICROPROCESSORS, GALLIUM ARSENIDES, INPUT OUTPUT PROCESSING, FIELD EFFECT TRANSISTORS, READ WRITE MEMORIES, LASER APPLICATIONS, DATA ACQUISITION, COMPLEMENTARY METAL OXIDE SEMICONDUCTORS, PRINTED CIRCUIT BOARDS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE