Accession Number : ADA325710

Title :   High Rate Sputter Deposition Method for Superconductors.

Descriptive Note : Final rept. 15 Aug 96-14 Feb 97,

Corporate Author : SOLAR ASSOCIATES MERRITT ISLAND FL

Personal Author(s) : Lampkin, Curtis M.

PDF Url : ADA325710

Report Date : 10 MAY 1997

Pagination or Media Count : 31

Abstract : Magnetron sputtering deposition is potentially the most economical deposition method for thin films. Presently sputtering can't deposit high temperature superconductors like Yttrium Barium Copper Oxide (YBCO) because of negative oxygen ion bombardment damage. Lowering the plasma discharge voltage to less than 100 volts would decrease such damage and make YBCO economically practical. The goal of this phase I effort was to lower plasma discharge voltages using high magnetic fields. Our results showed that high magnetic fields alone can lower plasma voltages to about 200 volts. Just as important, we showed that plasma impedance was lowered by more than ten times. Low plasma impedance allows high magnetic fields and electron injection into the plasma to be combined to lower plasma voltage to 30 volts. This combination removes the power limitations of electron injection. It should also produce epitaxial quality thin film semiconductors because low voltages allow 'self-bombardment' where the adatoms have the optimum energy to form a crystalline matrix at lower temperatures. The method is also applicable to thin film semiconductors such as II-VI solar cells and III-V films.

Descriptors :   *THIN FILMS, *DEPOSITION, *HIGH TEMPERATURE SUPERCONDUCTORS, *SPUTTERING, *MAGNETRONS, INJECTION, LOW TEMPERATURE, MAGNETIC FIELDS, AIR FORCE, OPTIMIZATION, HIGH RATE, LOW COSTS, PLASMAS(PHYSICS), ENERGY, SEMICONDUCTORS, ELECTRONS, OXIDES, COPPER COMPOUNDS, POWER, IMPEDANCE, BARIUM, LOW VOLTAGE, YTTRIUM OXIDES, ADATOMS.

Subject Categories : Inorganic Chemistry
      Electrical and Electronic Equipment
      Fabrication Metallurgy
      Electricity and Magnetism

Distribution Statement : APPROVED FOR PUBLIC RELEASE