Accession Number : ADA326178

Title :   Thermal Stress in Thin Films and Interconnects.

Descriptive Note : Final technical rept. 31 Jul 94-31 Jul 96,

Corporate Author : FLORIDA INTERNATIONAL UNIV MIAMI

Personal Author(s) : Cherepanov, Genady P.

PDF Url : ADA326178

Report Date : DEC 1995

Pagination or Media Count : 60

Abstract : The two dimensional closed system of partial differential equations and boundary conditions were derived with respect to thermal stresses in thin films and bonding layers of electronics for an arbitrary shape of a film/layer in plan view. Both thermoelastic materials with arbitrary temperature dependent constants and ideally thermoplastic materials were studied. Analytical solutions based on boundary layer philosophy were constructed, and the numerical code for thermal stresses in thin films and bonding layers was suggested.

Descriptors :   *THIN FILMS, *RESIDUAL STRESS, *PARTIAL DIFFERENTIAL EQUATIONS, *THERMAL STRESSES, *THERMOELASTICITY, ELECTRONICS, METALS, TWO DIMENSIONAL, CERAMIC MATRIX COMPOSITES, BOUNDARY VALUE PROBLEMS, THERMOPLASTIC RESINS, BONDING.

Subject Categories : Plastics
      Numerical Mathematics
      Mechanics
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE