Accession Number : ADA326540

Title :   Holographic Optical Interconnects for Multichip Modules.

Descriptive Note : Final rept. 1 May 91-30 Apr 96,

Corporate Author : NORTH CAROLINA UNIV AT CHARLOTTE

Personal Author(s) : Feldman, Michael R.

PDF Url : ADA326540

Report Date : 19 JUN 1997

Pagination or Media Count : 51

Abstract : For the past few years we have been working on the development of an optically interconnected Multichip Module (MCM). The MCM is composed of a planar transparent substrate, containing thin film electrical connections. GaAs laser array chips and silicon CMOS VLSI chips with integrated photodetectors are flip-chip bonded to one side of the substrate, while Computer Generated Holograms (CGHs) are fabricated on the other side of the substrate. The purpose of this work is to develop the technology to enable high speed and high density connections between chips, MCMs and PC boards. We believe that the basic approach and based on flip-chip and CGH technology will provide 1-2 orders of magnitude increase in connection performance when compared with conventional electrical connectors.

Descriptors :   *CIRCUIT INTERCONNECTIONS, *PHOTODETECTORS, *FLIP CHIPS, ELECTROOPTICS, GALLIUM ARSENIDES, THIN FILMS, TRANSPARENCE, SUBSTRATES, LASERS, DIFFRACTION, SILICON, MODULES(ELECTRONICS), ELECTRIC CONNECTORS, HOLOGRAMS.

Subject Categories : Lasers and Masers
      Electrooptical and Optoelectronic Devices
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE