Accession Number : ADA326973
Title : Thermal Management Research Studies. Volume 1. Electronics Cooling.
Descriptive Note : Final rept. Jun 91-Jan 96,
Corporate Author : QUESTECH INC DAYTON OH
Personal Author(s) : Ponnappan, Rengasamy
PDF Url : ADA326973
Report Date : 18 NOV 1996
Pagination or Media Count : 152
Abstract : An innovative cooling concept called 'venturi flow cooling' has been introduced and developed for potential use in the thermal management of the advanced high power electronic devices. Single phase cooling medium is effectively used to create very high velocities in localized region of interest to improve heat transfer. Several different test apparatus have been built to investigate the heat transfer and flow phenomena. Using the venturi flow system and water, power devices, such as MCT and IGBT, were successfully tested at their rated current and frequency levels never possible with other cooling methods. Heat flux up to 257 W/(sq. cm) and heat transfer coefficient up to 13 W/(sq. cm). deg C were demonstrated in this cooling system. This cooling technique is highly recommended for the future electronic cooling applications of the emerging more electric airplane systems involving very high intensity localized heat dissipation devices. This report presents the detailed descriptions of all aspects of this project.
Descriptors : *LIQUID COOLING, COMPUTER PROGRAM DOCUMENTATION, WATER FLOW, HIGH VELOCITY, DISSIPATION, THERMAL CONDUCTIVITY, TEMPERATURE CONTROL, HEAT FLUX, HEAT SINKS, HEAT TRANSFER COEFFICIENTS, LOAD CELLS, VENTURI TUBES.
Subject Categories : Electrical and Electronic Equipment
Air Condition, Heating, Lighting & Ventilating
Distribution Statement : APPROVED FOR PUBLIC RELEASE