Accession Number : ADA327599
Title : Resistivity of Fe.49 Co.49Ta.01 High Strength Laminates from -73C to + 650 C.
Descriptive Note : Final rept. 1 Dec 95-1 Apr 97,
Corporate Author : WRIGHT LAB WRIGHT-PATTERSON AFB OH
Personal Author(s) : Simon, Gerard K. ; Perrin, Ronald E. ; Obmer, Melvin C. ; Peterson, Timothy L. ; Culp, Charles E.
PDF Url : ADA327599
Report Date : 07 APR 1997
Pagination or Media Count : 10
Abstract : Telcon HS 50 Alloy is a recently developed iron-cobalt soft magnetic alloy (50.41% Fe, 48.75% Co, 0.45% Ta, 0.27% V, 0.08% Si, 0.04% Mn) intended for commercial applications requiring high strength. Its physical, electrical and magnetic properties have not yet been reported over the operating temperatures of interest. This report addresses the resistivity testing of this alloy in .006' thick strip product form (dry hydrogen annealed) and the subsequent conclusions. We tested the material in a cryogenic dewar from -73C to 27C and in a furnace to 650C. We found that at low temperatures, the resistivity of the material increased linearly. The coefficient of resistivity in this range was 1.1.x 10(exp-3)/C. At higher temperatures it increased faster than linear. The resistivity averaged 12.18 microohms-cm at the lowest temperature, l3.42microohms-cm at room temperature and 45.86 microohms-cm at the highest temperature. Analytic expressions for resistivity in the full temperature range of measurements are provided. Eddy current loss at room temperature is expected to be 1918 W/lb for .006' sheet at 5000 Hz.
Descriptors : *LAMINATES, *ELECTRICAL CONDUCTIVITY, *IRON COMPOUNDS, *HIGH STRENGTH, *MAGNETIC ALLOYS, TEST AND EVALUATION, LOW TEMPERATURE, MAGNETIC PROPERTIES, COMPOSITE MATERIALS, HIGH TEMPERATURE, RESISTANCE, ELECTRICAL PROPERTIES, ROOM TEMPERATURE, HYDROGEN, SILICON, LOSSES, DRY MATERIALS, TANTALUM, EDDY CURRENTS, VANADIUM, COBALT, MANGANESE, CRYOSTATS.
Subject Categories : Laminates and Composite Materials
Properties of Metals and Alloys
Electricity and Magnetism
Distribution Statement : APPROVED FOR PUBLIC RELEASE