Accession Number : ADA328732

Title :   Methodology, Tools and Demonstration of MCM System Optimization

Descriptive Note : Final rept.

Corporate Author : NORTH CAROLINA STATE UNIV AT RALEIGH

Personal Author(s) : Franzon, Paul D.

PDF Url : ADA328732

Report Date : 31 JUL 1997

Pagination or Media Count : 6

Abstract : Thin film/solder-bump packaging can be used to improve integrated circuit performance and cost. In this project we (1) designed and built a DES chip to demonstrate the advantages and (2) developed design methodology to support this design style, including appropriate CAD tools.

Descriptors :   *INTEGRATED CIRCUITS, *FLIP CHIPS, COMPUTER AIDED DESIGN, THIN FILMS, COMPUTER ARCHITECTURE, CENTRAL PROCESSING UNITS, PACKAGED CIRCUITS.

Subject Categories : Electrical and Electronic Equipment
      Computer Hardware

Distribution Statement : APPROVED FOR PUBLIC RELEASE