Accession Number : ADA329533
Title : Thermal Analysis of Multichip Modules Using Domain Decomposition and Wavelet-Capacitance Matrix
Descriptive Note : Final rept. 15 Sep 95-15 Dec 12
Corporate Author : PROMETHEUS INC SHARON MA
Personal Author(s) : An, M. ; Tolimieri, R. ; Weiss, J. ; Byrnes, J.
PDF Url : ADA329533
Report Date : 15 DEC 1996
Pagination or Media Count : 9
Abstract : Computational technology base for the solution of the initial value problem for 2-dimensional heat diffusion equation in a finite, composite multidimensional region has been developed. This is the first step toward creating a software design tool whose purpose is to accurately predict reliability and durability of multichip module designs. Singularities arising from material interfaces have been resolved by the multi resolution analysis based on wavelet-Galerkin method. Implementation strategies used for the wavelet-Galerkin method are: domain decomposition for partitioned and distributed computations; incorporating local and global data symmetries in all stages of the computations for reduction of memory and computations; using algebraic formalism for algorithm development and code generation; incorporating optimized FFT routines. Codes have been tested on several hardware platforms, both single and multiple CPU's.
Descriptors : *THERMAL ANALYSIS, COMPUTER AIDED DESIGN, FINITE ELEMENT ANALYSIS, CODING, SYMMETRY, FAST FOURIER TRANSFORMS, FLIP CHIPS, GALERKIN METHOD, WAVELET TRANSFORMS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE