Accession Number : ADA332204

Title :   Stress/Failure Analysis Software for Multi-Material Interfaces

Descriptive Note : Final rept. 15 Sep 95-15 Sep 96

Corporate Author : ENGINEERING SOFTWARE RESEARCH AND DEVELOPMENT INC ST LOUIS MO

Personal Author(s) : Actis, Ricardo L.

PDF Url : ADA332204

Report Date : 12 DEC 1996

Pagination or Media Count : 42

Abstract : An advanced capability for the evaluation of the mechanical strength of electronic components subjected to thermal and mechanical loading in two dimensions has been developed. The implementation is based on recent technological advances which make it possible to determine the natural straining modes and their intensities at singular points associated with multi-material interfaces numerically with a high degree of reliability. The computational techniques were implemented in a two dimensional setting as a module within the existing finite element analysis program of Stress Check. Stress Check is based on the p and hp versions of the finite element method and has several innovative capabilities, not available in other finite element programs. The feasibility of an analogous algorithm for the computation of the eigenpairs that characterize the temperature and displacement fields in the vicinity of singularities caused by multi-material interfaces in three dimensions was established.

Descriptors :   *STRESS STRAIN RELATIONS, *COMPUTER PROGRAMS, *FAILURE(ELECTRONICS), ALGORITHMS, SOFTWARE ENGINEERING, FINITE ELEMENT ANALYSIS, CHIPS(ELECTRONICS), STRENGTH(MECHANICS), FRACTURE(MECHANICS), THERMAL ANALYSIS, RELIABILITY(ELECTRONICS), THERMAL STRESSES, PACKAGED CIRCUITS.

Subject Categories : Mechanics
      Electrical and Electronic Equipment
      Computer Programming and Software

Distribution Statement : APPROVED FOR PUBLIC RELEASE