Accession Number : ADA332204
Title : Stress/Failure Analysis Software for Multi-Material Interfaces
Descriptive Note : Final rept. 15 Sep 95-15 Sep 96
Corporate Author : ENGINEERING SOFTWARE RESEARCH AND DEVELOPMENT INC ST LOUIS MO
Personal Author(s) : Actis, Ricardo L.
PDF Url : ADA332204
Report Date : 12 DEC 1996
Pagination or Media Count : 42
Abstract : An advanced capability for the evaluation of the mechanical strength of electronic components subjected to thermal and mechanical loading in two dimensions has been developed. The implementation is based on recent technological advances which make it possible to determine the natural straining modes and their intensities at singular points associated with multi-material interfaces numerically with a high degree of reliability. The computational techniques were implemented in a two dimensional setting as a module within the existing finite element analysis program of Stress Check. Stress Check is based on the p and hp versions of the finite element method and has several innovative capabilities, not available in other finite element programs. The feasibility of an analogous algorithm for the computation of the eigenpairs that characterize the temperature and displacement fields in the vicinity of singularities caused by multi-material interfaces in three dimensions was established.
Descriptors : *STRESS STRAIN RELATIONS, *COMPUTER PROGRAMS, *FAILURE(ELECTRONICS), ALGORITHMS, SOFTWARE ENGINEERING, FINITE ELEMENT ANALYSIS, CHIPS(ELECTRONICS), STRENGTH(MECHANICS), FRACTURE(MECHANICS), THERMAL ANALYSIS, RELIABILITY(ELECTRONICS), THERMAL STRESSES, PACKAGED CIRCUITS.
Subject Categories : Mechanics
Electrical and Electronic Equipment
Computer Programming and Software
Distribution Statement : APPROVED FOR PUBLIC RELEASE