Accession Number : ADD000440

Title :   Method of Manufacturing a Multi-Layered Strip Transmission Line Printed Circuit Board Integrated Package.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON D C

Personal Author(s) : Siefker,Robert G

Report Date : 25 Feb 1975

Pagination or Media Count : 8

Abstract : The patent relates to a plurality of printed circuit boards which are fixedly joined and are positioned in stacked relationship; which are in electrical interconnection; and, which are structured as a single integrated multi-layer unit. More particularly, the invention relates to a preferred method of manufacturing the package.

Descriptors :   *Printed circuits, *Patents, Manufacturing, Strip transmission lines, Integrated systems, Layers, Fabrication

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE