Accession Number : ADD000558

Title :   Dielectric Circuit Board Bonding.

Descriptive Note : Patent Application,


Personal Author(s) : Misfeldt,Charles C

Report Date : 29 Oct 1974

Pagination or Media Count : 22

Abstract : The patent application describes a method and apparatus for bonding of dielectric circuit boards for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together. The finished circuit may include a bonded-in ground plate of copper wire cloth or the like and may include through-plate holes. The technique includes the build-up of thin films to provide strength, toughness and dimensional accuracy. Orthogonal positioning of directional stresses and cooling under pressure have a stabilizing effect. A normal bonding cycle comprises (1) loading the parts to be bonded in a confining mold, (2) placing a conforming mold plate within the mold and closing the parts in a press, (3) pressing for a predetermined time at a predetermined elevated temperature and (4) shock cooling the material before removing pressure from the mold.

Descriptors :   *Printed circuits, *Bonding, Patents, Dielectrics, Microwave equipment

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE