Accession Number : ADD000558
Title : Dielectric Circuit Board Bonding.
Descriptive Note : Patent Application,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Misfeldt,Charles C
Report Date : 29 Oct 1974
Pagination or Media Count : 22
Abstract : The patent application describes a method and apparatus for bonding of dielectric circuit boards for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together. The finished circuit may include a bonded-in ground plate of copper wire cloth or the like and may include through-plate holes. The technique includes the build-up of thin films to provide strength, toughness and dimensional accuracy. Orthogonal positioning of directional stresses and cooling under pressure have a stabilizing effect. A normal bonding cycle comprises (1) loading the parts to be bonded in a confining mold, (2) placing a conforming mold plate within the mold and closing the parts in a press, (3) pressing for a predetermined time at a predetermined elevated temperature and (4) shock cooling the material before removing pressure from the mold.
Descriptors : *Printed circuits, *Bonding, Patents, Dielectrics, Microwave equipment
Subject Categories : Electrical and Electronic Equipment
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE