Accession Number : ADD000963

Title :   Evaporation Source for Device Metallization.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON D C

Personal Author(s) : Hall,Edward L ; Philofsky,Elliott M

Report Date : 28 Aug 1973

Pagination or Media Count : 2

Abstract : The patent describes an evaporation source provided for device metallization. The evaporation source, an aluminum alloy comprises the chemical composition in percent by weight: 0.5 silicon, 0.5 iron, 3.8 to 4.9 copper, 0.3 to 0.9 manganese, 1.2 to 1.8 magnesium, 0.1 chromium, 0.25 zinc, balance aluminum.

Descriptors :   *Aluminum alloys, *Metallizing, *Patents, Silicon, Evaporation, Thin films

Subject Categories : Coatings, Colorants and Finishes
      Metallurgy and Metallography

Distribution Statement : APPROVED FOR PUBLIC RELEASE