Accession Number : ADD000967

Title :   Three Dimensional Circuit Modules for Thick-Film Circuits and the Like and Methods for Making Same.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON D C

Personal Author(s) : Muckelroy,William L ; Hawkins,Sandra R

Report Date : 04 Sep 1973

Pagination or Media Count : 6

Abstract : The patent relates to circuits which are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.

Descriptors :   *Modules(Electronics), *Patents, Printed circuits, Thick films, Circuits, Substrates, Cylindrical bodies

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE