Accession Number : ADD001066
Title : Process for Flattening Alumina Substrates.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON D C
Personal Author(s) : Weinstein,Robert N
Report Date : 12 Feb 1974
Pagination or Media Count : 3
Abstract : The patent describes a process for flattening ceramic substrates. The process includes positioning the ceramic substrates to be flattened or contoured between high purity ground alumina plates and exerting a predetermined amount of force on the positioned ceramic substrate during an annealing cycle. The annealing cycle includes slowly heating the ceramic substrate from ambient temperature over a time interval of about 12 hours to attain a temperature of about 2580F., maintaining the ceramic substrate at the specified temperature for about 12 hours until straightening occurs, and thereafter, slowly cooling the ceramic substrate to ambient temperatures.
Descriptors : *Substrates, *Forming techniques, *Patents, Alumina, Ceramic materials, Printed circuits
Subject Categories : Electrical and Electronic Equipment
Ceramics, Refractories and Glass
Distribution Statement : APPROVED FOR PUBLIC RELEASE