Accession Number : ADD001066

Title :   Process for Flattening Alumina Substrates.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON D C

Personal Author(s) : Weinstein,Robert N

Report Date : 12 Feb 1974

Pagination or Media Count : 3

Abstract : The patent describes a process for flattening ceramic substrates. The process includes positioning the ceramic substrates to be flattened or contoured between high purity ground alumina plates and exerting a predetermined amount of force on the positioned ceramic substrate during an annealing cycle. The annealing cycle includes slowly heating the ceramic substrate from ambient temperature over a time interval of about 12 hours to attain a temperature of about 2580F., maintaining the ceramic substrate at the specified temperature for about 12 hours until straightening occurs, and thereafter, slowly cooling the ceramic substrate to ambient temperatures.

Descriptors :   *Substrates, *Forming techniques, *Patents, Alumina, Ceramic materials, Printed circuits

Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass

Distribution Statement : APPROVED FOR PUBLIC RELEASE