Accession Number : ADD001118

Title :   Method for Sintering Thick-Film Oxidizable Silk-Screened Circuitry.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON D C

Personal Author(s) : Muckelroy,William L

Report Date : 10 Apr 1973

Pagination or Media Count : 7

Abstract : The patent describes a method for sintering thick-film oxidizable silk-screened circuitry comprising printing a glass land surrounding the microcircuit, thereby forming a bridge, on the substrate and covering the same with a glass plate in a non-oxidizing atmosphere, and sintering the same.

Descriptors :   *Printed circuits, *Sintering, *Patents, Thick films, Copper, Ceramic materials, Substrates, Microcircuits

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE