Accession Number : ADD001287

Title :   Ultrasonic Bond Monitor.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Cusick,John H ; Brown,Alvin E ; Hamamoto,Al S ; Bellin,Jack L S

Report Date : 06 Aug 1974

Pagination or Media Count : 6

Abstract : The patent describes a system and method for monitoring the bond strength of ultrasonic bonds. A measure of bond quality is obtained non-destructively, by developing a voltage which proportional to the amplitude of the transverse motion of the ultrasonic bonding tool, and also developing, by means of a transducer, a second voltage proportional to the tangential component of the forces applied during bonding. The voltages are fed into a logic curcuit to derive their ratio, which is a measure of the bonding quality.

Descriptors :   *Ultrasonic welding, *Monitors, *Patents, *Nondestructive testing, Bonded joints, Monitoring, Quality control

Subject Categories : Mfg & Industrial Eng & Control of Product Sys
      Test Facilities, Equipment and Methods

Distribution Statement : APPROVED FOR PUBLIC RELEASE