Accession Number : ADD001287
Title : Ultrasonic Bond Monitor.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Cusick,John H ; Brown,Alvin E ; Hamamoto,Al S ; Bellin,Jack L S
Report Date : 06 Aug 1974
Pagination or Media Count : 6
Abstract : The patent describes a system and method for monitoring the bond strength of ultrasonic bonds. A measure of bond quality is obtained non-destructively, by developing a voltage which proportional to the amplitude of the transverse motion of the ultrasonic bonding tool, and also developing, by means of a transducer, a second voltage proportional to the tangential component of the forces applied during bonding. The voltages are fed into a logic curcuit to derive their ratio, which is a measure of the bonding quality.
Descriptors : *Ultrasonic welding, *Monitors, *Patents, *Nondestructive testing, Bonded joints, Monitoring, Quality control
Subject Categories : Mfg & Industrial Eng & Control of Product Sys
Test Facilities, Equipment and Methods
Distribution Statement : APPROVED FOR PUBLIC RELEASE