Accession Number : ADD001409
Title : Method and Electrolyte for Producing a Copper Plated Microstrip.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Tolego,Emil ; Sprague,Dennis R ; Macanu,Erick F
Report Date : 24 Sep 1974
Pagination or Media Count : 2
Abstract : The patent relates to a microstrip and method of making it, including a specially formulated copper-plating bath. The microstrips are fabricated by chrome-copper evaporation on substantially pure aluminum oxide substrates. After chrome-copper evaporation, a copper plating is applied, employing the new electroplating bath formulation.
Descriptors : *Strip transmission lines, *Patents, Copper, Electroplating, Electroplating solutions, Substrates
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE