Accession Number : ADD001409

Title :   Method and Electrolyte for Producing a Copper Plated Microstrip.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Tolego,Emil ; Sprague,Dennis R ; Macanu,Erick F

Report Date : 24 Sep 1974

Pagination or Media Count : 2

Abstract : The patent relates to a microstrip and method of making it, including a specially formulated copper-plating bath. The microstrips are fabricated by chrome-copper evaporation on substantially pure aluminum oxide substrates. After chrome-copper evaporation, a copper plating is applied, employing the new electroplating bath formulation.

Descriptors :   *Strip transmission lines, *Patents, Copper, Electroplating, Electroplating solutions, Substrates

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE