Accession Number : ADD001893
Title : Bonding Material for Planar Electronic Device.
Descriptive Note : Patent Application,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Fredberg,Marvin L
Report Date : 22 May 1974
Pagination or Media Count : 7
Abstract : The patent application relates to a composition for bonding integrated circuits to a heat sink and conducting heat therebetween. The composition is comprised of a thermoplastic polymer resin adhesive for supplying the bonding strength, a solvent for softening the adhesive to a putty like substance, and a filler for increasing the thermal conductivity of the adhesive.
Descriptors : *Adhesives, Patents, Thermoplastic resins, Solvents, Ketones, Fillers, Alumina, Bonding, Integrated circuits, Heat sinks, Thermal conductivity
Subject Categories : Electrical and Electronic Equipment
Adhesives, Seals and Binders
Distribution Statement : APPROVED FOR PUBLIC RELEASE