Accession Number : ADD001893

Title :   Bonding Material for Planar Electronic Device.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Fredberg,Marvin L

Report Date : 22 May 1974

Pagination or Media Count : 7

Abstract : The patent application relates to a composition for bonding integrated circuits to a heat sink and conducting heat therebetween. The composition is comprised of a thermoplastic polymer resin adhesive for supplying the bonding strength, a solvent for softening the adhesive to a putty like substance, and a filler for increasing the thermal conductivity of the adhesive.

Descriptors :   *Adhesives, Patents, Thermoplastic resins, Solvents, Ketones, Fillers, Alumina, Bonding, Integrated circuits, Heat sinks, Thermal conductivity

Subject Categories : Electrical and Electronic Equipment
      Adhesives, Seals and Binders

Distribution Statement : APPROVED FOR PUBLIC RELEASE