Accession Number : ADD002199

Title :   Electroless Deposition of Copper and Copper-Tin Alloys.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON D C

Personal Author(s) : Pearlstein,Fred ; Weightman,Robert F

Report Date : 11 Mar 1975

Pagination or Media Count : 4

Abstract : The patent relates to electroless bath compositions for the deposition of copper or copper-tin alloys, said baths being devoid of formaldehyde or potassium heptagluconate and having less alkalinity than prior art baths, said baths providing highly adherent deposits to such substrates as steel, for example, and consisting of: Copper sulfate.5H2O, Di-sodium salt of Ethylenediamine tetra-acetic acid.2H2O, Ammonium hydroxide (28 percent NH3), Dimethylamine borane, and, if a copper-tin alloy deposit is desired, stannous chloride.2H2O.

Descriptors :   *Coatings, *Copper, *Copper alloys, *Tin alloys, *Patents, Steel, Solutions(Mixtures), Amines

Subject Categories : Coatings, Colorants and Finishes

Distribution Statement : APPROVED FOR PUBLIC RELEASE