Accession Number : ADD002599

Title :   Method for Making Beam Leads for Ceramic Substrates.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Lindberg,Frank A

Report Date : 02 Apr 1976

Pagination or Media Count : 9

Abstract : The patent application describes a method for making beam leads for use in the interconnecting of electronic devices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.

Descriptors :   *Circuit interconnections, Electric connectors, Microelectronics, Substrates, Integrated circuits, Microcircuits, Ultrasonic welding

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE