Accession Number : ADD002599
Title : Method for Making Beam Leads for Ceramic Substrates.
Descriptive Note : Patent Application,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Lindberg,Frank A
Report Date : 02 Apr 1976
Pagination or Media Count : 9
Abstract : The patent application describes a method for making beam leads for use in the interconnecting of electronic devices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.
Descriptors : *Circuit interconnections, Electric connectors, Microelectronics, Substrates, Integrated circuits, Microcircuits, Ultrasonic welding
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE