Accession Number : ADD003205

Title :   Dielectric Circuit Board Bonding.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Misfeldt,Charles C

Report Date : 03 Aug 1976

Pagination or Media Count : 8

Abstract : The patent describes a method and apparatus for bonding of dielectric circuit boards for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together.

Descriptors :   *Bonding, *Patents, Printed circuit boards, Dielectrics, Microwave equipment, Strip transmission lines

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE