Accession Number : ADD003205
Title : Dielectric Circuit Board Bonding.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Misfeldt,Charles C
Report Date : 03 Aug 1976
Pagination or Media Count : 8
Abstract : The patent describes a method and apparatus for bonding of dielectric circuit boards for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together.
Descriptors : *Bonding, *Patents, Printed circuit boards, Dielectrics, Microwave equipment, Strip transmission lines
Subject Categories : Electrical and Electronic Equipment
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE