Accession Number : ADD004055

Title :   Flip Chip Fiber Film Coupler.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Fenner,Milton A ; Hsu,Hui Pin

Report Date : 17 May 1977

Pagination or Media Count : 12

Abstract : A method and means for endfire coupling an optical fiber to an optical channel waveguide. The fiber is laid in a longitudinal groove in a substrate so that the core of the fiber lies just above the surface of the substrate. The waveguide channel is located on the surface of a second substrate which is placed on top of the first so that the end of the waveguide channel abuts against the end of the optical fiber. Registration grooves on the surface of the lower substrate and registration channels on the surface of the upper substrate aid in the alignment. (Author)

Descriptors :   *Patent applications, *Optical waveguides, *Fiber optics, *Flip chips, Coupling(Interaction), Thin films, Channels, Substrates, Grooving, Chips(Electronics)

Subject Categories : Electrical and Electronic Equipment
      Fiber Optics and Integrated Optics

Distribution Statement : APPROVED FOR PUBLIC RELEASE