Accession Number : ADD004189

Title :   Method of Hermetically Sealing Semiconductor Devices.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON D C

Personal Author(s) : Kim,Chung K ; Cho,Yung L

Report Date : 26 Jul 1977

Pagination or Media Count : 4

Abstract : A method of hermetically sealing semiconductor devices utilizes a dielectric tube with a two step structure at one end. The tube is used to surround a semiconductor. The two step end of the tube is metallized. The other end of the tube is flat and is brazed onto a metal stud so that the semiconductor is in the center of the brazed joint. A metal lid is painted with a conductive material and then placed into a rim formed by the two step end. When the paint dries, a metal layer is electrodeposited at the top of the lid and tube. (Author)

Descriptors :   *Patents, *Hermetic seals, *Semiconductor devices, Dielectrics, Tubes, Metallizing, Brazed joints, Conduction(Heat transfer), Coatings, Electrodeposition, Encapsulation

Subject Categories : Electrical and Electronic Equipment
      Adhesives, Seals and Binders

Distribution Statement : APPROVED FOR PUBLIC RELEASE