Accession Number : ADD004565

Title :   Insulation of Microcircuit Interconnecting Wires.

Descriptive Note : Patent,


Personal Author(s) : Murdoch,Francis J

Report Date : 11 Jan 1977

Pagination or Media Count : 5

Abstract : A very-fine microcircuit interconnecting wire is passed through a central orifice in a capillary bonding head of a thermo-compression device which is used for pressing the balled end, or the body, of the microcircuit interconnecting wire to the metallized pads of a hybrid circuit chip. A pair of capillary tubes are movably attached to the capillary bonding head in such a way that they can be positioned with their orifices opposing each other on opposite sides of the very fine wire just below the central orifice of the capillary bonding head. An insulating adhesive or enamel is passed through the capillary tubes to blend around the wire and form an insulating layer as the capillary bonding head is moved from one bonding point to the next. (Author)

Descriptors :   *Patents, *Electrical insulation, *Microcircuits, Electric connectors, Bonding, Fabrication, Advanced systems

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE