Accession Number : ADD004984

Title :   Missile Adaptation Kit Assembly.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Will,Albert S ; Wilson,Robert R ; Black,Samuel J

Report Date : 27 Sep 1977

Pagination or Media Count : 10

Abstract : This patent describes a high density component assembly package for a missile including a plurality of circular bulkheads axially supported by rigid spacing members to form a cylindrical adaption kit. Electronic components are mounted on and/or between the bulkheads with the electrical interconnections therebetween accomplished by the use of flat printed cables wrapped around the periphery of the assembly. (Auhtor)

Descriptors :   *Patents, *Guided missile components, Modular construction, Shock resistance, Impact shock

Subject Categories : Underwater-launched Guided Missiles

Distribution Statement : APPROVED FOR PUBLIC RELEASE