Accession Number : ADD005816

Title :   Impact Sound Stressing Holding Assembly.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON D C

Personal Author(s) : Francis,James F ; Hearn,W ; Dessauer,Ralph G

Report Date : 20 Feb 1979

Pagination or Media Count : 4

Abstract : A holding assembly for impact sound stressing semiconductor wafers and the like including a novel fixture for securing the wafer across a sound tube by clamping between Teflon rings. A cover membrane is also secured across the sound tube to create a closed space defined by the sound tube, cover membrane and semiconductor wafer. Tungsten spheres located in the closed space bounce between the wafer and the membrane when vibrations are propagated in the sound tube for impact sound stressing the semiconductor wafer. (Author)

Descriptors :   *Patents, *Semiconductors, *Wafers, *Acoustic emissions, Impact tests, Holders, Sound pressure, Acoustic attenuation, Stress analysis, Test fixtures, Tubes, Clamps, Rings, Fluorinated hydrocarbons

Subject Categories : Electrical and Electronic Equipment
      Acoustics
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE