Accession Number : ADD005855

Title :   Solventless Amine Epoxy Resin System.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Rhyn,Elmer J ; Foote,Kenneth R ; Handler,George S ; Diebold,James P

Report Date : 22 Jul 1977

Pagination or Media Count : 14

Abstract : A solventless amine-epoxy resin system which is made up of (1) a binary aromatic amine mixture of 2,6-diaminopyridine and meta-phenylene diamine in a weight ratio of from about 1:4 to about 4:1; and (2) an epoxy mixture of (a) the diglycidyl ether of bisphenol A, and (b) 1,4-butanediol diglycidyl ether in an amount sufficient to reduce the initial viscosity of the total amine-epoxy resin system to a value in the range of from about 500 to about 2000 cps at 25 C. The amount of aromatic amine mixture present in the amine-epoxy resin system is from about 0.90 to about 1.10 times the stoichiometric amount necessary to cure the epoxy mixture. The amine-epoxy resin systems of the present invention are used as the matrix for filament wound rocket and missile cases. (Author)

Descriptors :   *Patent applications, *Epoxy resins, *Amines, Aromatic compounds, Glycidyl ether, Butanols, Phenylenediamines, Pyridines, Phenols, Matrix materials, Filament wound construction

Subject Categories : Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE