Accession Number : ADD006557

Title :   Method for Connecting to Semiconductor Chips without the Use of Wires.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s) : Nieberlein ,Vernon A ; Crisco,Melvin F

Report Date : 21 Sep 1978

Pagination or Media Count : 6

Abstract : The method of this invention uses a machinable glass ceramic substrate into which an opening is provided for accommodating a semiconductor chip that is mounted flush with the top surface of the substrate to permit the screen printing of an electrically conductive pattern directly to the semiconductor chip and substrate surfaces. This method of construction eliminates the use of wires on hybrid microelectronic circuits for making the final electrical connection from conductor pattern on substrate surface to the semiconductor chip surface. (Author)

Descriptors :   *Patent applications, *Semiconductor devices, *Chips(Electronics), *Substrates, *Connectors, Ceramic materials, Surfaces, Microelectronics, Electrical conductivity, Inventions, Hybrid systems, Glass, Selection, Resistors, Capacitors, Bending, Circuits

Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass
      Laminates and Composite Materials

Distribution Statement : APPROVED FOR PUBLIC RELEASE