Accession Number : ADD007081

Title :   Cooling Apparatus for Electronic Modules.

Descriptive Note : Patent Application,


Personal Author(s) : Bosler,Alan J ; Nash,Larry E

Report Date : 19 Feb 1980

Pagination or Media Count : 14

Abstract : The present invention provides an improved cooling arrangement for a standard electronic plug-in module assembly having a plurality of standard modules supported in grooves in parallel side plates. Each module has a metallic heat plate which facilitates the transfer of heat from the electronic components to the parallel metallic sides which support the modules. A spring is provided in each groove in the side plates for upwardly biasing each module. A top cold plate is forced downwardly by a screw-operated wedge plate and this cold plate engages a metal frame on each electronic module. The springs in the grooves are compressed and apply a force which insures good contact between the cold plate and each frame of each module thereby facilitating transfer of heat away from each electronic module. The top plate is provided with passages for carrying a cooling liquid for removing heat transferred from the modules to the top plate. It is therefore a general object of the present invention to provide an improved cooling arrangement for an electronic plug-in module assembly.

Descriptors :   *Patent applications, *Liquid cooling, Modules(Electronics), Electronic equipment

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE