Accession Number : ADD007148

Title :   Improved Method of Infrared Laser Soldering.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Cox,Walter K ; Prifli,William E ; Whitehouse,David R

Report Date : 23 Oct 1979

Pagination or Media Count : 13

Abstract : A method and apparatus for attaching miniaturized chip components to substrates is provided. The output of a 1.06 micron wavelength laser is aperturned or attenuated and the attenuated energy is monitored before passing through a cylinder lens which focuses and directs the energy to the intersection of the chip component and the substrate pad so that heat travel in the material is limited and soldering of narrow capacitor or component widths is permitted. (Author)

Descriptors :   *Patent applications, *Infrared lasers, *Soldering, *Methodology, Chips(Electronics), Substrates, Capacitors, Lenses, Cylindrical bodies, Inventions

Subject Categories : Lasers and Masers
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE