Accession Number : ADD007227

Title :   A Simplified Multilayer Circuit Board.

Descriptive Note : Patent Application,


Personal Author(s) : Patz,Benjamin W

Report Date : 17 Mar 1980

Pagination or Media Count : 14

Abstract : A multilayer printed circuit board is disclosed having appropriate ground and voltage planes. The multi-layer printed circuit board includes a mounting plane, a plurality of dielectric sheets stacked upon the mounting plane, a plurality of conductive sheets positioned between adjacent dielectric sheets, and a plurality of rectangular shaped apertures passing through the multilayer printed circuit board. Each rectangular shaped aperture of the multilayer printed circuit board has a plurality of voltage connector terminals. Electrical connection from one of the conductive sheets to the appropriate voltage connector terminal is provided by a conductive disc which passes through a hole located within the multilayer printed circuit board. (Author)

Descriptors :   *Patent applications, *Printed circuit boards, Layers, Circuit interconnections

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE