Accession Number : ADD007980

Title :   High Temperature-Resistant Conductive Adhesive and Method Employing Same.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Shaheen,Joseph M

Report Date : 11 Nov 1980

Pagination or Media Count : 3

Abstract : The present invention resides in a high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate. Broadly speaking, the composition comprises a mixture of an alloy of gallium-tin eutectic and gold and a polyimide resin. More specifically, the composition comprises an alloy containing about 20 to 80 weight percent of gallium-tin eutectic and about 80 to 20 weight percent gold, based on a total of 100 weight percent, and about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy. As is well known, the gallium-tin eutectic contains 89 weight percent gallium and 11 weight percent tin.

Descriptors :   *Patents, *Adhesives, *Formulations(Chemistry), *Adhesive bonding, Heat resistant materials, Eutectic composites, Gallium alloys, Tin alloys, Gold, Polyimide resins, Semiconductors, Dies, Substrates, Inventions

Subject Categories : Adhesives, Seals and Binders

Distribution Statement : APPROVED FOR PUBLIC RELEASE