Accession Number : ADD008305

Title :   Mechanical Acceleration Multiplier for Microcircuit Bond Testing.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s) : Layden,Owen P ; Murdoch,Francis J

Report Date : 13 Mar 1979

Pagination or Media Count : 4

Abstract : This patent discloses a mechanical acceleration multiplier for testing the bond strength of an adhesive wherein the adhesive to be tested is subjected to centrifugal force.

Descriptors :   *Patents, *Adhesive bonding, *Bonded joints, *Microcircuits, *Test equipment, Inventions, Chips(Electronics), Substrates, Multimode, Loads(Forces)

Subject Categories : Electrical and Electronic Equipment
      Couplers, Fasteners, and Joints
      Mfg & Industrial Eng & Control of Product Sys
      Test Facilities, Equipment and Methods

Distribution Statement : APPROVED FOR PUBLIC RELEASE