Accession Number : ADD008464

Title :   Electrical Connection.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Scott,William R

Report Date : 11 Feb 1980

Pagination or Media Count : 24

Abstract : The present invention relates to electrical connections and formation thereof, and more particularly to electrical connections and formation thereof usable on heat-sensitive substrates or members. The interconnection includes adhesive material such as epoxy disposed between and attaching an electrically conductive member to another member, and a single contiguous electrically conductive coating applied to adjacent portions of these two members to electrically connect them. The other member can be a heat-sensitive member such as a PVF2 film. The other member need not necessarily be a conductive member; for example, PVF2 film can be used in a transducer. The other member can first be partially masked to expose only those portions of the member which are to receive the conductive coating. To form the connection, one or more electrically conductive members, such as metallic wires or electrodes, are fixed to the second member with adhesive such as epoxy. Adjacent areas of the conductive and of the other member are then coated with a contiguous conductive coating such as by sputtering gold thereon. Especially for a PVF2 or other polymer piezoelectric transducer, the other member should be masked before coating, and then unmasked after applying the coating, where multiple connections are desired, to prevent arcing, etc.

Descriptors :   *Patent applications, *Electric connectors, *Piezoelectric transducers, *Fluoropolymers, *Polyvinylidenes, Piezoelectric materials, Electrical resistance, Electrical conductivity, Metal coatings, Gold, Electric terminals, Electric wire, Electrodes, Adhesives, Epoxy compounds, Adhesive bonding, Thermal properties

Subject Categories : Personnel Management and Labor Relations
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE