Accession Number : ADD008603

Title :   A Wedge Assembly.

Descriptive Note : Patent Application,


Personal Author(s) : Block,Sheldon A

Report Date : 14 May 1980

Pagination or Media Count : 8

Abstract : A wedge assembly for securing a circuit board in an electronic package gives positive surface contact and excellent heat transfer between the multi-layer board and the electronic package as well as positive lock under vibration and shock. A housing, which may be mounted on a multi-layer board, contains a wedge member having two ramped ends within an open cavity having a single ramped end. Means such as a ramped anvil which slides within the cavity under force from a screw is provided within the cavity for adjusting the wedge member relative to the housing to provide positive contact between the electronic package and the multi-layer board. (Author)

Descriptors :   *Patent applications, *Circuit boards, *Heat transfer, Electronic equipment, Wedges, Housings, Surfaces, Cavities, Packaging, Assembly, Layers, Vibration

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE