Accession Number : ADD008790

Title :   Method of Attaching Led Chip to a Header.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Zaeschmar,Guenther

Report Date : 09 Jun 1981

Pagination or Media Count : 3

Abstract : A method is disclosed of fabricating light emitting diodes to prevent degradation caused by thermally induced stress. A voltage is applied across the chip to cause it to bend to a prestressed condition while it is being soldered to the header. The biasing voltage applied is continued until after the heat is removed and the solder cooled leaving the diode in the prestressed condition.

Descriptors :   *Patents, *Light emitting diodes, *Crystal lattices, *Soldering, *Crystal defects, Gallium arsenides, Thermal stresses, Degradation, Bias, Stresses, Voltage, Prestressing, Heat, Manufacturing

Subject Categories : Electrooptical and Optoelectronic Devices
      Mfg & Industrial Eng & Control of Product Sys
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE