Accession Number : ADD008790
Title : Method of Attaching Led Chip to a Header.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Zaeschmar,Guenther
Report Date : 09 Jun 1981
Pagination or Media Count : 3
Abstract : A method is disclosed of fabricating light emitting diodes to prevent degradation caused by thermally induced stress. A voltage is applied across the chip to cause it to bend to a prestressed condition while it is being soldered to the header. The biasing voltage applied is continued until after the heat is removed and the solder cooled leaving the diode in the prestressed condition.
Descriptors : *Patents, *Light emitting diodes, *Crystal lattices, *Soldering, *Crystal defects, Gallium arsenides, Thermal stresses, Degradation, Bias, Stresses, Voltage, Prestressing, Heat, Manufacturing
Subject Categories : Electrooptical and Optoelectronic Devices
Mfg & Industrial Eng & Control of Product Sys
Solid State Physics
Distribution Statement : APPROVED FOR PUBLIC RELEASE