Accession Number : ADD008911

Title :   Right Circular Substrate Packaging.

Descriptive Note : Patent application,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s) : Ruwe,Victor W ; Kerr,James A ; Sandeau,Rene F , Jr

Report Date : 03 Aug 1981

Pagination or Media Count : 9

Abstract : In the past, microelectronics have basically been packaged on flat surfaces and therefore into shapes that do not take full advantage of the circular shape of a missile. Therefore, it can be seen that the higher packaging density of approximately 30%, due to a circular shape with ease of interconnection and sealing in structural assembly to other missile components, is needed. In accordance with this invention, a circular packaging device is provided which includes a multiplicity of concentric cylinders that are configured and assembled with electronic components on the outside and/or inside surfaces of the cylinders with the cylinders being spaced with insulation spacers between the cylinders and with end caps for opposite ends of the cylinders with lead connections mounted in the end caps for connecting to individual circuits mounted on the cylinders and for providing for interconnections through the assembly.

Descriptors :   *Patent applications, *Packaging, *Microelectronics, *Cylindrical bodies, Electronics, Electric connectors, Circular, Insulation, Spacers, Substrates, Surfaces, Inventions, Shape, Packing density

Subject Categories : Electrical and Electronic Equipment
      Containers and Packaging

Distribution Statement : APPROVED FOR PUBLIC RELEASE