Accession Number : ADD009545

Title :   Multilayler Via Resistors.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s) : Ansell,Joseph L ; Baker,Raymond J

Report Date : 10 Nov 1981

Pagination or Media Count : 4

Abstract : A substrate has two or more conductive layers deposited thereon, each adjacent layer pair separated by a dielectric layer. Aperture are formed in the dielectric layer and are filled with resistor paste. In this way, a resistive path may be formed between the conductive layers. This concept of fabricating resistors are particularly useful in the inclusion of pull-up, pull-down and other non-critical resistors in the circuitry contained within a thick film construction. (Author)

Descriptors :   *Patents, *Resistors, *Layers, Substrates, Conductivity, Deposition, Dielectrics, Apertures, Fabrication, Circuits, Inventions

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE