Accession Number : ADD009675

Title :   Thin Film Microstrip Circuits.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Hall,R D

Report Date : 08 Mar 1982

Pagination or Media Count : 9

Abstract : A four layer thin film metallization system is comprised of layers of tantalum, chromium, copper and gold and is useful in high resolution, low loss microstrip circuits. The metallization system is compatible with lead-tin solder and, in addition, provides low insertion losses at X-band frequencies. (Author)

Descriptors :   *Patent applications, *Strip transmission lines, Layers, Thin films, Circuits, Gold, Low loss, Chromium, Soldering, Tantalum, High resolution, Copper, Metallizing, Insertion loss, Substrates, X band

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE