Accession Number : ADD009762

Title :   Electrical Connection.

Descriptive Note : Patent,


Personal Author(s) : Scott,William R ; Bloomfield,Philip ; Weist,William T ; McMahon,Karen M

Report Date : 13 Jul 1982

Pagination or Media Count : 8

Abstract : A mechanical and electrical connection for a piezoelectric member of polymeric material such as polyvinylidene fluoride, and method for forming such a connection. To form the connection, the piezoelectric member is first masked to prevent a preselected portion of its surface from being coated during subsequent coating operations. An electrically conductive member such as a lead wire or a solderable terminal is then attached to the nonmasked area of the piezoelectric member with adhesive such as epoxy. The masked piezoelectric member, the electrically conductive member, and (incidentally) the mask are then coated with a conductive coating such as sputtered gold to electrically connect the conductive member to the piezoelectric member. The mask can now be removed from the piezoelectric member if desired, although it can be left in place as a convenient vise. If the conductive member is a wire, adjacent portions of the wire and the piezoelectric member can now be coated with additional epoxy to provide heat dissipation for and protect the electrical connection provided by the conductive coating, and to insure mechanical strength of the contact. If the conductive member is a terminal strip or solderable terminal, a wire can now be soldered to the conductive coating at the terminal using low temperature solder. The solder joint can then be coated with silver-filled paint to produce a lower current density and lower contact resistance in the vicinity of the contact.

Descriptors :   *Patents, *Electric connectors, *Coatings, Polymers, Strength(Mechanics), Polyvinylidenes, Heat resistant materials, Substrates, Lead wires, Alloys, Soldering, Wire, Electrical conductivity, Inventions, Adhesives, Heat loss, Low temperature

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE