Accession Number : ADD010284

Title :   Damping Package for Surface Acoustic Wave Devices.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s) : Goll,Jeffrey H

Report Date : 09 May 1983

Pagination or Media Count : 9

Abstract : This invention relates generally to surface acoustic wave (SAW) devices, and more particularly to the elimination or minimization of bulk waves in such devices. Surface acoustic wave devices, including convolvers and filters, may have bulk modes induced in addition to the desired surface wave. Such bulk modes produce spurious responses which denigrate the usefulness of these devices. The crystal substrate of a surface acoustic wave device is provided with a backing layer on its lower surface. This backing layer is fabricated to have approximately the same acoustic impedance as the substrate for the bulk modes of concern, but is of an acoustically lossy material. Such a backing layer may be fabricated, for example, from tungsten powder and powdered vinyl.

Descriptors :   *Patent applications, *Surface acoustic wave devices, *Damping, *Suppressors, *Spurious effects, Surface acoustic waves, Acoustic impedance, Losses, Wave propagation, Vinyl plastics, Powders, Surfaces, Substrates, Packaging, Single crystals, Materials, Tungsten, Signals, Response, Surface waves, Inventions, Powder metals, Crystals

Subject Categories : Acoustics

Distribution Statement : APPROVED FOR PUBLIC RELEASE