Accession Number : ADD010465

Title :   Tin and Gold Plating Process.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Hall,R Dean

Report Date : 19 Jul 1983

Pagination or Media Count : 7

Abstract : A process used for plating a substrate in which the etching of the substrate's copper cladding is terminated early leaving a thin layer of copper. Resist material is then selectively placed upon this thin layer of copper in such a manner that will result in those areas of the circuit to be electroplated being connected. Etching is then resumed to completion, resulting the electrical isolation of those portions of the circuit that are not to be electroplated. Gold electroplating followed by electro-less tin plating of the remainder of the circuit can then be performed followed by a final etching to remove the electrical shorts. (Author)

Descriptors :   *Patents, *Plating, *Gold, Tin, Electroless plating, Substrates, Copper, Metal coatings, Methodology, Electrical insulation, Circuits, Thin films, Cladding

Subject Categories : Coatings, Colorants and Finishes
      Metallurgy and Metallography

Distribution Statement : APPROVED FOR PUBLIC RELEASE