Accession Number : ADD010565

Title :   Integral Electric Module and Assembly Jet Cooling System.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Mayer,Arnold H

Report Date : 16 Aug 1983

Pagination or Media Count : 6

Abstract : An improved printed circuit board housing assembly is described wherein localized high intensity cooling of heat dissipating electronic components mounted on the circuit boards may be accomplished by direct impingement of streams of fluid coolant onto individual components; when coolant is passed through the housing, fluid streams, generated at openings provided in the circuit boards, impinge onto electronic components mounted on the next circuit board downstream from the source of coolant flow. (Author)

Descriptors :   *Patents, *Circuit boards, *Cooling and ventilating equipment, *Air cooled, Coolants, Modular construction, Electronic equipment, Downstream flow, Integrated systems, Jet flow, Electric power, High rate, Holes(Openings), Cooling, Assembly, Apertures, Intensity, Fluids, Impingement, Streams, Sources, Housings, Orifices

Subject Categories : Electrical and Electronic Equipment
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE