Accession Number : ADD010582

Title :   Multi Level Resist Technique for Lithography on Ceramic Substrates.

Descriptive Note : Patent Applications,


Personal Author(s) : Peckerar,Martin C ; Mak,Steve S Y

Report Date : 19 Aug 1983

Pagination or Media Count : 13

Abstract : A method for forming a microelectronic circuit and the microelectronic circuit produced by the method. A three level multiresist layer is deposited on the metal-coated surface of a substrate. The multiresist includes a thick polyimide layer, a thin metal layer, and a photo resist layer. A circuit pattern is formed in the photo resist layer and etched into the thin metal layer. The thin metal layer is utilized as a mask for plasma etching the circuit pattern into the thick polyimide layer and for exposing a region of the metal coating corresponding to the circuit pattern. A metallization is then formed by up-plating on the exposed metal coating. The resulting microelectronic circuit has very tight fabrication tolerances and includes a metallization with nearly vertical sidewalls.

Descriptors :   *Patent applications, *Lithography, *Microelectronics, *Circuits, *Fabrication, Ceramic materials, Substrates, Layers, Polyimide resins, Metal coatings, Photoresistors, Etching, Patterns, Methodology

Subject Categories : Electrooptical and Optoelectronic Devices

Distribution Statement : APPROVED FOR PUBLIC RELEASE