Accession Number : ADD010869

Title :   Apparatus and Method for Measuring Adhesive Bond Strength.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s) : Gould,L D ; Garfield,D E

Report Date : 31 Aug 1982

Pagination or Media Count : 5

Abstract : An improved apparatus is disclosed for measuring the adhesive bond strength between two materials. A short, cylindrical specimen having a test surface of one material is attached to a rigid base on which a slide is mounted on preloaded rollers for movement along a pair of tracks provided on the base. Above the specimen, a rigid mold block is supported on an axially extending arm formed integrally with the slide. The peripheries of the specimen and the mold block are essentially aligned so that seal ring may be moved into engagement with a narrow gap formed between the specimen and the mold block. The second material, whose adhesive bond to the first material is to be determined, is introduced into the volume defined between the mold block and the specimen and caused or allowed to solidify there. The seal ring is then moved away from the gap and a force is applied to the slide to move it along the base, thereby applying a shear force to the adhesive bond between the two materials. The force and deformation are measured at which failure of the adhesive bond occurs. A method of using such an apparatus also is disclosed. (Author)

Descriptors :   *Patents, *Measuring instruments, *Adhesive bonding, *Strength(Mechanics), *Materials, Structural analysis, Cylindrical bodies, Shear stresses, Loads(Forces), Deformation, Failure(Mechanics), Shear strength

Subject Categories : Adhesives, Seals and Binders
      Metallurgy and Metallography
      Mfg & Industrial Eng & Control of Product Sys
      Test Facilities, Equipment and Methods

Distribution Statement : APPROVED FOR PUBLIC RELEASE